Embedded Module TQMxCU1-HPCM COM-HPC® Mini Module with Intel® Core™ Ultra Processors (Series 1)

Codename: Meteor Lake U/H

TQMxCU1-HPCM
  • Intel® Core™ Ultra 7 and Intel® Core™ Ultra 5 with 15 W / 28 W TDP
  • New Chiplet-Technology for optimized high-speed interconnect and improved power eficiency
  • Up to 14 CPU Cores based on Intel® Hybrid-Technology with various combinations of Performance-Cores and Efficient-Cores
  • Deliver stunning graphics and AI-focused performance
  • High-bandwidth extandability through up to 16 PCIe Gen4/5 lanes
  • High-speed peripheral and network interfaces with USB 3.2 Gen2 (10 Gb/s) and 2x 2.5 Gigabit Ethernet
  • USB 4 / USB-C support
  • COM-HPC® Mini formfactor for extremely compact integration
The COM-HPC Mini Module TQMxCU1-HPCM equipped with Intel Core Ultra processors offers impressive performance data in the field of AI and graphics for the edge. Traditional use cases in industry, healthcare, communication and security thus can be extended and benefit from the latest technology: Several different compute engines work together to accelerate inference tasks directly on site, for example, while reducing the need for a discrete accelerator. The latest manufacturing technology ensures particularly good power efficiency, enabling simplified cooling solutions and fanless designs.
The feature set of the processors can be optimally made available via the 400-pin high-speed connector of the COM-HPC Mini standard. In combination with the extremely compact dimensions of just 95 mm x 70 mm, innovative solutions can be implemented in the smallest of spaces. The soldered LPDDR5 memory on the top significantly simplifies thermal integration into systems, as all critical components can be optimally connected and heat build-up between components is avoided

CPU/Processor data

CPU/Processor:
  • Intel® Core™ Ultra 7 Processor 165H (6P+8E, up to 5 GHz / 128 EU / 24 MB / 28W)
  • Intel® Core™ Ultra 7 Processor 155H (6P+8E, up to 4.8 GHz / 128 EU / 24 MB / 28 W)
  • Intel® Core™ Ultra 5 Processor 135H (4P+8E, up to 4.6 GHz / 128 EU / 18 MB / 28 W
  • Intel® Core™ Ultra 5 Processor 125H (4P+8E, up to 4.5 GHz / 112 EU / 18 MB / 28 W)
  • Intel® Core™ Ultra 7 Processor 165U (2P+8E, up to 4.9 GHz / 64 EU / 12 MB / 15W)
  • Intel® Core™ Ultra 7 Processor 155U (2P+8E, up to 4.8 GHz / 64 EU / 12 MB / 15 W)
  • Intel® Core™ Ultra 5 Processor 135U (2P+8E, up to 4.4 GHz / 64 EU / 12 MB / 15 W)
  • Intel® Core™ Ultra 5 Processor 125U (2P+8E, up to 4.3 GHz / 64 EU / 12 MB / 15 W)

Memory

LPDDR5x:
  • 16 / 32 / 64 GB, Dual Channel
EEPROM:
  • 32kbit

Graphics

Display:
  • 1x eDP 1.4b (4K @ 60 Hz)
  • 2x DDI (DP 1.4b / HDMI 2.1) (up to 2x8K)

Communication interfaces

Ethernet:
  • 2x 2.5 Gigabit Ethernet (Intel i226)
USB:
  • 4x USB 3.2 Gen2 (up to 10 Gb/s)
  • 8x USB 2.0
  • USB 4 / USB-C Support
SATA:
  • 2x SATA Gen3 (up to 6 Gb/s) (multiplexed with PCIe)

Other interfaces

PCIe:
  • Four PCIe groups with up to 16 PCIe lanes: PCIe x4, PCIe x4, PCIe x1/x1/x1/x1 or x2/x2 or x4, PCIe x1/x1/x1/(x1)
SPI:
  • 1x eSPI
  • 1x SPI (for external UEFI BIOS flash)
I2C:
  • 2x I2C
SMBus:
  • 1x SMBus
UART:
  • 2x Serial port
GPIO:
  • 12x GPIO

Other functions

TPM:
  • TPM 2.0 (SLB9672) (assembly option)
Board Controller:
  • TQMx86 board controller with watchdog

General data/basic data

Dimensions:
  • 95 mm x 70 mm
Plug-in System:
  • COM-HPC Mini
Temperature range:
  • Standard temperature: 0°C…+60°C
Power supply:
  • Main Voltage: 12 V / RTC Battery Voltage: 3 V
Power consumption:
  • typ. 10 - 35 W / max. 78 W (preliminary)

OS-Support

OS Support:
  • Windows 10 / Windows 10 IoT Enterprise 2021 LTSC
  • Windows 11
  • Linux

User Manual TQMxCU1-HPCM (2 MB, pdf)

TQMxCU1-HPCM-AA

Intel® Core™ Ultra 7 165H (6P+8E, 8Xe, 24 MB, 28 W TDP), 32 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/x1 | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AB (standard)

Intel® Core™ Ultra 7 155H (6P+8E, 8Xe, 24 MB, 28 W TDP), 32 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/x1 | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AC

Intel® Core™ Ultra 5 135H (4P+8E, 8Xe, 18 MB, 28 W TDP), 32 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/x1 | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AD (standard)

Intel® Core™ Ultra 5 125H (4P+8E, 7Xe, 18 MB, 28 W TDP), 16 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/x1 | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AE

Intel® Core™ Ultra 7 165U (2P+8E, 4Xe, 12 MB, 15 W TDP), 32 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/- | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AF (standard)

Intel® Core™ Ultra 7 155U (2P+8E, 4Xe, 12 MB, 15 W TDP), 16 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/- | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AG

Intel® Core™ Ultra 5, 135U (2P+8E, 4Xe, 12 MB, 15 W TDP), 32 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/- | x4 | x4 | x4 - SS-Lane-Config1)

TQMxCU1-HPCM-AH (standard)

Intel® Core™ Ultra 5 125U (2P+8E, 4Xe, 12 MB, 15 W TDP), 16 GB LPDDR5, TPM 2.0, C-Temp  
(default UEFI: PCIe x1/x1/x1/- | x4 | x4 | x4 - SS-Lane-Config1)

Other module configurations

Please get in contact with us

TQMxCUx-HPCM-HSP-AA (Accessory)

Heatspreader for TQMxCU1-HPCM module according to PICMG standard.

TQMxCUx-HPCM-KK-AA (Accessory)

Active cooling solution for TQMxCU1-HPCM module (incl. 12V fan).

MB-COMHPCM-1-AA

Carrierboard for evaluation of COM-HPC Mini module TQMxCU1-HPCM with SS-Lane-Config2 (1x DDI, 1x USB4), Size: Mini ITX (no accessories included).

MB-COMHPCM-1-AB

Carrierboard for evaluation of COM-HPC Mini module TQMxCU1-HPCM with SS-Lane-Config1 (2x DDI, no USB4), Size: Mini ITX (no accessories included).

STKXCU1-HPCM-xxx

Starterkit for evaluation of COM-HPC Mini module TQMxCU1-HPCM (incl. carrierboard, cpu module, cooling, accessories).
Please get in contact with us to define module configuration.

Support

Comprehensive information from the software area such as BSP documentation, tutorials, FAQs, sample codes and are available in our Support Wiki.

 

Application examples

3265,33

Our USPs

  • Unbeatable long-term availability
  • Robustness for all applications
  • The most comprehensive range of modules on the market
  • A comprehensive design and support of an E²MS manufacturer
  • Full design freedom, as all processor functions are fully accessible
  • x86 for tough industrial use

Embedded downloads

Current downloads such as product data sheets, manuals, application notes as well as software and drivers can be found in the Download Center.

 

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