With the TQMa117xL system-on-chip module based on NXP's i.MX RT1170 crossover CPU family, TQ offers the optimal foundation for implementing cost-effective and energy-efficient control systems.
The TQMa117xL scores with a compact size of only 31 mm x 31 mm and provides all CPU signals via a total of 277 LGA pads. The module is equipped with sufficient memory (LP-SDRAM, Quad-SPI-NOR-Flash and EEPROM), an optional security chip as well as a PMIC (Power Management IC) connected to the CPU. Thus, TQMa117xL meets even the highest demands. Thanks to the versatility of the processor and the very good power dissipation of less than one watt, this module design offers multiple application possibilities in many control tasks.
The new generation of NXP's i.MX RT processor family is also called a crossover CPU, as it bridges the gap between CPU and MCU: Thus, the device combines a powerful Arm Cortex-M7 core with up to 1 GHZ CPU clock, supported by a Cortex-M4 core (up to 400 MHZ clock) with many interfaces, e.g. Gigabit Ethernet, CAN FD, USB 2.0, UART and SPI. In addition, the module is equipped with a graphics processing unit (GPU) with 2D acceleration. Reliable, high-performance module operation even at higher temperatures is ensured by an external PMIC that is independent of the CPU. This means that the standard temperature range is -25 °C to +85 °C; the extended temperature range of -40 °C to +85 °C is also available as an option.
The TQMa117xL is equipped with a 16-bit wide LP SDRAM, which allows a memory expansion of up to 64 GB. A Quad-SPI NOR flash memory with a capacity of up to 256 MB is used as read-only memory. Further system components such as an external and thus power-saving real-time clock (RTC), a user EEPROM memory and a temperature sensor round off the module design.
Free RTOS - including many application examples - is offered as the operating system. For application areas that require increased security functions, the EdgeLock SE050 security chip from NXP is available as an assembly option. The module is soldered directly to the mainboard due to the LGA technology and is therefore also suitable for areas of application that require a very flat and robust design.
In addition to a variety of interfaces such as two Gigabit Ethernet (GbE), two USB 2.0 as well as two CAN FD (galvanically isolated) and an SD card interface, four digital 24 volt inputs/outputs each for controlling external peripheral devices are also implemented. The connection of touch displays with a resolution of up to 1280 x 800 pixels is possible via a MIPI DSI or alternatively an LVDS interface.
The mainboard offers a special expansion option with its analog front end from NXP (NAFE13388B40BS): With it, up to eight programmable analog inputs can be used to realize uncomplicated current, voltage and resistance measurements.
In addition, the mainboard, which is only 160 mm x 100 mm in size, scores with WiFi and cellular options, scalable from NB-IoT (Narrow Band) to LTE, for wireless communication. Three user LEDs and a CSI interface with two lanes for camera connection as well as the possibility to supply the industrial mainboard completely via Ethernet (PoE) make the design perfect.
The SBC (Single Board Computer), consisting of soldered LGA module and mainboard, can also be used as an already qualified industrial board due to its many functions. In addition, it can be used as a basis for own designs: Starting with smart HMI solutions in building automation via decentralized intelligence for various control systems up to real-time acquisition of sensor data in automation.
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